EE论坛:Signal Integrity for High-Speed Digital Design
发布于:2017-07-05 09:46:53   |   作者:[学院] 电工学院   |   浏览次数:1391



讲座题目:Signal Integrity for High-Speed Digital Design

主讲人:   Dr. Jun Fan(范峻,美国密苏里科技大学教授)



Signal integrity is the practice of ensuring sufficient fidelity of a signal transmitted between a driver and a receiver for proper functioning of the circuit, e.g., the signals over the high-speed bus between a processor and its chip-set.  The integrity of a signal in real-world applications is compromised by artifacts of the layout of the circuits on a printed circuit board, the type of IC package being used, and is impacted by the circuit logic family, power delivery network, and other aspects of high-speed digital design.  These non-ideal, real-world effects can lead to severely distorted voltage and current waveforms and signal jitter, and result in faulty switching and logic errors.  This short course gives a brief introduction to the fundamentals of signal integrity.



Jul 10, 9:00 AM-12:00 AM

  • Missouri S&T EMC Laboratory Introduction
  • Applications and Challenges of EMC Technologies in High-Speed Hardware Designs

Jul 11, 9:00 AM-12:00 AM

  • Signal Integrity: Introduction, Spectrum, PCB/Package, and Resonant Circuit

Jul 12, 9:00 AM-12:00 AM

  • Transmission Lines for High-Speed Signaling


Jun Fan (S’97-M’00-SM’06-F’16) received his B.S. and M.S. degrees in Electrical Engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively. He received his Ph.D. degree in Electrical Engineering from the University of Missouri-Rolla in 2000. From 2000 to 2007, he worked for NCR Corporation, San Diego, CA, as a Consultant Engineer. In July 2007, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), and is currently a Professor and Director of the Missouri S&T EMC Laboratory. Dr. Fan also serves as the Director of the National Science Foundation (NSF) Industry/University Cooperative Research Center (I/UCRC) for Electromagnetic Compatibility and Senior Investigator of Missouri S&T Material Research Center. His research interests include signal integrity and EMI designs in high-speed digital systems, dc power-bus modeling, intra-system EMI and RF interference, PCB noise reduction, differential signaling, and cable/connector designs. In the IEEE EMC Society, Dr. Fan served as the Chair of the TC-9 Computational Electromagnetics Committee from 2006 to 2008, the Chair of the Technical Advisory Committee from 2014 to 2016, and a Distinguished Lecturer in 2007 and 2008. He currently is an associate editor for the IEEE Transactions on Electromagnetic Compatibility and IEEE EMC Magazine. Dr. Fan received an IEEE EMC Society Technical Achievement Award in August 2009.