学科建设
EE论坛:Modeling and simulation for EMC and Signal/Power Integrity of High Speed Electronics
发布于:2017-08-31 10:28:56   |   作者:[学院] 电工学院   |   浏览次数:3389

讲座时间:2017年9514:30-15:30

讲座地点:C218

讲座题目:Modeling and simulation for EMC and Signal/Power Integrity of High Speed Electronics

主讲人: Dr.Enxiao Liu (IEEE EMC Society Distinguished Lecturer),Senior Scientist and Deputy Department Director,A*STAR Institute of High Performance Computing, Singapore

 

报告简介:Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modern high-speed electronics. Relentless increase in the operation frequency, and high integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensible role in modern high speed electronic design.

This talk will first give an overview of the different categories of methodologies used for SI/PI/EMC modeling and simulation of high speed electronics. Then it is focused on the modal decomposition based 2.5D methodologies and their applications. Recent development of the 2.5D methodology for analysis of SI/PI and EMC in multilayer PCBs will finally be presented.

 

 

主讲人简介:En-Xiao Liu (M’05-SM’09) received the Ph.D. degree in electrical engineering from the National University of Singapore in 2005.In the same year he joined the Institute of High Performance Computing (IHPC), A*STAR, Singapore, where he is currently Senior Scientist and Deputy Department Director of the Electronics and Photonics Department. He is an adjunct Associate Professor in the Electrical and Computer Engineering Department of the National University of Singapore. He has published over 90 papers in refereed international journals and conferences, and two book chapters. His research interests are in the areas of computational electromagnetics, high-speed electronics, and electromagnetic compatibility (EMC).

Dr. Liu received the Technical Achievement Award from the IEEE EMC Society in 2016, Singapore Ministry of Trade Industry (MTI) Borderless Silver Award in 2015, and several Best Paper Awards. He is currently an IEEE EMC Society Distinguished Lecturer, an Associate Editor of the IEEE Transactions on CPMT, and a Guest Editor of the IEEE Transactions on EMC. He served as the chair of the IEEE EMC Singapore Chapter in 2009 and 2012-2013. He has also contributed to more than 10 different international conferences in various capacities, such as General Chair, Technical (Program) Chair, International Advisory Committee member, and Organizing Chair. He is currently the General Chair for the 2018 joint IEEE EMC & APEMC Symposium to be held in Singapore during 14-17 May 2018.