讲座时间：2018年4月3日15:00

讲座地点：沙河电子楼137

讲座题目：Material challenges in advanced flip chip packaging

主讲人：殷文博士，美国Intel封装研究技术中心高级工程师

报告简介：semiconductor packaging has been growing more complex and vulnerable while quality and reliability requirement becomes ever demanding for existing and new market segments in the same time. Packaging materials have become, in many area, the limiting factor for high density and effective package design. This talk tries to present an overview of the current semiconductor advanced flip chip packaging trend, the many materials employed in flip chip packaging, as well as some of the real industrial packaging material challenges we have encountered during advanced packaging development.

Keywords:  Flip chip packaging, packaging material.

主讲人简介：殷文博士， 2003年毕业于中国科技大学化学物理系，2009年于美国弗吉尼亚理工大学从事材料领域研究并获得博士学位， 2009-2011年于美国橡树岭国家实验室从事材料研究。2011至今在美国Intel公司封装测试研发中心从事研发和项目管理工作并拥有多项封装技术国际专利。